IPC 2231A

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This document provides guidelines for establishing a best practice methodology for use in developing a formal DFX (Design for Manufacturing, Fabrication, Assembly, Testability, Cost, Reliability, Environment, Reuse) process for layout of printed board assemblies that utilize surface mount and through hole devices.

Product Details

Published:
08/01/2021
Number of Pages:
60
File Size:
1 file , 1.9 MB
Product Code(s):
2231-STD-0-P-0-EN-A, 2231-STD-0-P-0-EN-A