This Material and Process Characterization/Qualification Test records changes in Surface Insulation Resistance (SIR) on a representative sample of a printed circuit assembly (PCA). It quantifies any deleterious effects that might arise from solder flux or other process residues left on external surfaces after soldering, which can cause unwanted electro-chemical reactions that grossly affect reliability.
- Number of Pages:
- File Size:
- 1 file , 1.9 MB
- Product Code(s):
- 9202-STD-0-D-0-EN-A , 9202-STD-0-D-0-EN-A
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