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The IPC 6th Annual National Conference on Flexible Circuits revealed new manufacturing technologies, test strategies and applications. Anyone using, designing or manufacturing flexible circuits will find the conference proceedings invaluable. These proceedings include papers on: patterned microvia connections for thin multilayer circuits, electrochemical migration in flex circuits, flex based packaging solutions – from CSPs to MEMS, the use of finite element modeling in the design of flexible circuits, and non contact testing of high density flexible circuits. 196 pages. 16 papers and presentations. Release Date June 2000.

Product Details

Published:

06/01/2000

Number of Pages:

196